Alumina Ceramic Plate with Metallizetion

Production technology

 Mold production and laser cutting, the specifications can be made strictly according to the customers' requirements.

Metallization

The surface can be covered a lay of metallization,such as Ag, Pd-Ag,Mo-Mn, Ni-plating with good tensile strength: Mo-Mn thickness: 25~40μm,Ni thickness:3~7μm, Tensile strength≥120MPa,which is widely used in the electric vacuum switch pipe.

Applications

 96% alumina metallized ceramic substrate is widely used in the Thick Film Circuit,large-scale integrated circuit,HIC,semi-conductor assembly,Chip Resistor, potentiometer,power module and other relative areas.

Please let us know the 5 important things of your need for product.

1. What size of product do you need?

2. What about is the allowable tolerance?

3. what is the material do you need for the ceramic product?

4. where do you use such substrate ? 

5. How much is your quantity demand?

#If you can give us your technic drawing,we will be very appreciate.

If you need more information or have any question,pls kindly let us know and we will reply to you A.S.A.P!