PCB Metallized Ceramics/Alumina Ceramics

1.Material:95%-99.8% Alumina

2.The surface can be covered a lay of metallization,such as Ag, Pd-Ag, Mo-Mn-Ni-plating

3.Mo-Mn thickness: 25~40μm,Ni thickness:3~7μm, Tensile strength≥120MPa

4.Sizes can be made strictly according to the customers' requirements

Introduction

 Alumina Metallized Ceramicsare characterized by high adhesive strength, good flux and excellent stability in solder baths. Their excellent mechanical, electrical and thermal properties make our metallized substrates suitable for use in the following fields:

Power electronics
Power modules, rectifiers, thyristors, ignition elements

Thermo-electrical applications
Peltier, heating and cooling elements

Optoelectronics

Light emitting diodes, optocouplers, photo diodes, photo transistors, reflex sensors, photo logic sensors

Substrates
Substrates for electrical inductors and sensors

Electronic applications
Special single-layer substrates for microelectronic semiconductors

Please let us know the 5 important things of your need for product.

1. What size of product do you need?

2. What about is the allowable tolerance?

3. what is the material do you need for the ceramic product?

4. where do you use such substrate ? 

5. How much is your quantity demand?

#If you can give us your technic drawing,we will be very appreciate.

If you need more information or have any question,pls kindly let us know and we will reply to you A.S.A.P!