X-ray BGA inspection machine testing PCB motherboard, Lithium battery, IC Bonding, BGA Soldering and more. Used for BGA, CSP,LED,Flip Chip,Semiconductor,Battery Industry, Small Metal Casting,Electronic Connector Module,Aerospace  Components,Photovoltaic Industry and other special industry.

Application:
1. Semiconductor: Inner structure of IC, FC, CSP package inspection
2. Aluminum casting relates to cars, bubble &fissure of rubber and resin products inspection
3. Short & open circuit in BGA package, bubble area in BGA inspection and auto-judgment
4. Aerospace and military, aerofoil, bullet etc.
5. Troche in medicine, FRP in chemical products, resin, ceramics.
6. Lithium battery, electronic components (capacitor, resistor, diode & audion, led etc.) inspection

Features:
1. Imported Micro X-Ray tube with original packaging(100/130Kv closed tube), highly-sensitive image intensifier, 1.3 million pixels industrial digital CCD camera, able to detect item <5μm,display clear image.
2. Adjustable high power geometric & system magnification, easy to find out tiny defect with high detecting speed.
3. System navigation chart, navigating rapidly and positioning accurately.
4. Observe object at ±70°, detecting from particular angle, easy to detecting inner structure
5.Five axis moving coordinately, with function of CNC auto-detects in quantity, suitable for detecting in large quantity with high accuracy.
6. 23" digital image-special LCD monitor, displaying large and high definition image.
7. Multi-function software system, free maintenance and update for life.
8. Complete seal lead cabinet, comply with the provisions of the international and domestic X-ray safety standards.

Specification: