BGA rework station automatic pick and place repair motherboard of mobile and laptop
BGA rework station automatic pick and place repair motherboard of mobile and laptop

BGA rework station automatic pick and place repair motherboard of mobile and laptop

USD $1 - $19,999 /Set

Min.Order:1 Set

Supply Ability:
100 Set / Sets per Month
Port:
Shenzhen/Hong kong
Payment Terms:
T/T PayPal

Quick Details View All >

Place of Origin:
Guangdong, China
Brand Name:
Shuttle Star
Model Number:
RW-E6250
Condition:
New
After-sales Service Provided:
Engineers available to service machinery overseas

Shenzhen Shuttle Star Technology Co., Ltd.

Business Type: Manufacturer,Trading Company
Shenzhen Guangdong China
Main Products: BGA Rework Station ,Mini Wave Solder ,Nozzle Cleanning Machine ,X-Ray Inspection Equipment ,Desktop Reflow Oven

Product Details

Automatic bga rework station used to solder and desolder SMD BGA components. Fix Xbox, PS3/4, Mobile phone motherboard and more.

Main Features
  • Has both the auto soldering and mounting function; adopts high-precision K-type thermocouple & close cycle control.
  • Profile analysis, setting and amendment can be carried out at any time, mass memory for parameters saving. 
  • High definition CCD color optical system with functions of split vision, 27X optical zoom and 270X digital zoom.
  • Be provided with  human-friendly software functions, including "IC hold", profile suspending or time-lapse, screen lock etc. 
  • Movable heating heads to fit for reworking BGA in different positions; nitrogen port available to make the BGA rework process under the nitrogen protection.
  • Suction nozzle can identify material and mounting height automatically.
  • With function of over-heating protection and air lost protection.
  • Large bottom IR area heater can heat the PCB evenly to avoid deformation; heating board is independently controlled.
  • Suitable for any kind of BGA package, including CCGA,BGA,QFN,CSP,LGA,Micro SMD,MLF(Micro Lead Frames).BGA rework station automatic pick and place repair motherboard of mobile and laptopBGA rework station automatic pick and place repair motherboard of mobile and laptopBGA rework station automatic pick and place repair motherboard of mobile and laptopBGA rework station automatic pick and place repair motherboard of mobile and laptopBGA rework station automatic pick and place repair motherboard of mobile and laptopBGA rework station automatic pick and place repair motherboard of mobile and laptopBGA rework station automatic pick and place repair motherboard of mobile and laptopBGA rework station automatic pick and place repair motherboard of mobile and laptopBGA rework station automatic pick and place repair motherboard of mobile and laptopBGA rework station automatic pick and place repair motherboard of mobile and laptopBGA rework station automatic pick and place repair motherboard of mobile and laptop
Specification
PCB & Component Requirements
 PCB Max Size 450mm×400mm
 Max. Processing Area 120mm×120mm
 Max. PCB Thickness 4mm
 Max. Component Size 70mm×70mm
 Min. Component Size 4mm×4mm
 Max. Component Wieght 80g
Vision System Specifications  
 Max. Vision Range 40mm×40mm
 Min. Pitch 0.30mm
 Micrometer Adjust Range Front/Rear ±10mm, Left/Right ±10mm
 Rotation Angle 360°
Thermal Specification  
 Max. Hot Air Head Temp. 350°c
 Max. Lower IR Heat 400°c
 Heat Control Adjustment 8-stage Programmable Temperature Settings
 Upper Heater Power 1000W
 Lower Heater Power 1000W
 Bottom IR Heater Power 3600W
Dimensions & Power Requirements  
 System Demension L850mm×W700mm×H950mm
 Weight Appox. 150Kg
 Power Requiement Single Phase, 220V AC, 50/60Hz
 Air Supply 5˜8kfg/cm, 60L/min
Packaging & Shipping

Packaging: Standard Wooden Case with Machine fixed inside

Delivery: Delievery within 1 week after get payment

BGA rework station automatic pick and place repair motherboard of mobile and laptop 

Standard Accessories
ItemQty.
BGA Reball Kit(BK98D)    ×1set      
Stencil/Mask      ×33pcs      
Solder Paste/Flux   ×1tin      
Leaded Solder Ball(0.45, 0.5, 0.6mm)     ×1tins      
Upper Nozzle(five for upper, two for bottom)     ×7pcs      
PCB Clamp for Laptop Motherboard    ×1set     
Temperature Measurement Wire   ×1pc     
High Temperature Cloth   ×1pc     
Hex Key Wrench-set   ×1pc     
Aluminum Plate   ×1pc     
FAQ

1. How about the package ? Is it safe during the delivery ?
All machines are packed with strong wooden case filled with foam. Wooden bars support the package from deformation and the machines are carefully wrapped with waterproof packing. You don't need to worry about safety issue during delivery.

2. What is the delivery way ? How many days will the machine arrrive us ?
We will ship the machine by DHL,Fedex, UPS,etc (Door to Door Service), around 5 days to arrive.
Or by Air to your airport (Door to Airport Service ), around 3 days to arrive.
Or by Sea to the seaport, around 30 days to arrive.

3. How do I operate the machine if I don't have any experience, is it hard to operate?
Our machines are designed to use easily. We provide user friendly English manual. It will take you 1-2 hours to learn how to operate well. If you have any problem, we also provied operation video online.

4. Will you arrange it if I send sample board to your factory for evaluation? Do your company provide OEM?
Yes, we will arrange it for free and warmly welcome you to visit our factory. We can customize products according to your needs.

5. What is the way of payment?
We accept L/C, T/T, Moneygram, Paypal etc.

Company Information

Shenzhen Shuttle Star Technology Co., Ltd. is one of the earliest professional BGA rework station manufacturer in China. Ever since founded in 2000, the product structure and performance are improved constantly according to the market demand and the product series has covered the from high-end to low-end and can provide complete solutions for the BGA reparation operation according to the special demand of customer.

 

Contact Us

Contact us now! We will reply you within 12 hours!BGA rework station automatic pick and place repair motherboard of mobile and laptop 

Contact Supplier

Ms. Mavis Xie Bussiness Manager Chat Now
Telephone
86-755-27512579
Mobile
13510894956
Fax
86-755-27513966
Address
10F,BeiFangJun Buliding,XingWeiRoad Crossing,FuYong,Baoan District,Shenzhen Shenzhen,Guangdong

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