Specifications

-Good quality factory price,
-Simple to use
- IR hot air heating
-chips under 50*50mm
-CE passed

 

 

kit stencil bga/reballing smd/bga rework station/laptop repair tools/puhui t870a/infrared hand tool/selective soldering machine/taian

 

 

 

Technical parameters

 

 

 

 

 

Power: 1000W

 

Voltage: AC110V-220V 50/60HZ

 

Infrared lamp body power: 150W

 

Preheating plate power: 800W

 

Working bench size: 360*240mm

 

Infrared lamp body heating size: 50*50mm

 

Preheating plate size: 240*180mm

 

Preheating plate temperature range: 60-200C

 

Infrared lamp body temperature range: 200-450C

 

 

 

 

 

Features:

 

 

 

1. Infrared welding technology .

 

2. Infrared heating, can avoid the IC damage due to the fast or uninterrupted heating up.

 

3. Easy operate; user can operate skillfully after one-day training.

 

4. No need welding tools, it can weld any chips under 50mm.

 

5. With 800W hot melt system, preheating range 240*180mm.

 

6. It doesn’t impact the smart parts without hot air, and suits to weld BGA, SMD, CSP, LGA, QFP, PLCC and BGA reballing.

 

7. It suits for a variety of computer, notebook, play station’s BGA components, especially in a Northbridge/ Southbridge chipset of computer.

 

Packing:

 

 

 

We are the manufacture of this product,if you have any questions,pls tell me.Thanks!

 

Tai'an Puhui Electric Technology Co.,Ltd.