YCS R1 Smart Hot Air Gun 1000W High Power BGA Soldering Rework Station for Mobile Phone PCB Chip Repair. The YCS R1 hot air gun is equipped with 4 nozzles and can be used for soldering and desoldering BGA SMD chips of various electronic products, such as iPhone, iPad, mobile phones, tablets, laptops, etc.

Features:
1. High-power heating core, 1000W high-power imported heating core, fast heating and accurate heating, precise temperature, suitable for welding and desoldering of large solder joints.
2. Curve mode, temperature control curve provides uniform temperature, reduces thermal shock, and will not damage the chip.
3. Large chip mode, fast heating strong airflow; small chip mode, efficient conversion soft airflow.
4. Heating mode, YCS specially developed, fully upgraded, convenient, cutting-edge technology.
5. Full-view HD color screen, dynamic power, real-time display, temperature control at a glance.
6. Standard 4 nozzles, 5MM/10MM/12*17MM/13*13MM.
7. Menu instructions, convenient industrial-grade hot air repair, high-resolution (HD) color screen, temperature adjustment, airflow adjustment, temperature memory and power switch.
8. 1000W optimal power temperature control, temperature control curve provides uniform temperature, long-life heating core, less thermal shock.

Product Parameters:
Name: YCS Intelligent Hot Air Gun R1.
Size: 195*180*130mm.
Gross Weight: 2900g.

Packing List:
Air Gun R1 *1.
Nozzles *4.
Power Cord *1.
User Manual *1.