Specifications

BGA rework station T-870A
- Repair chips under 50*50mm
- Automatic infrared heating
- Easily operate
- Best price

T870A Manufacturer PUHUI infrared bga rework station

Laptop motherboard repair station 

Best bga chips reballing station

Tai'an     Manufacturer

Yours  Friend Joyce

Skype: qiao.joyce

                                  EASY TO USE !   HOT  SALE !

 

 

                              IN STOCK !

 

 

 

Features
 

1. Infrared welding technology which was developed independently.

 

2. Infrared heating is easy to pierce and distribute evenly,can avoid the IC damage due to the fast or uninterrupted heating up.

 

3. Easy operate; user can operate skillfully after one-day training.

 

4. No need welding tools, it can weld any chips under 50mm.

 

5. With 800W hot melt system, preheating range 240*180mm.

 

6. It doesn’t impact the smart parts without hot air, and suits to weld BGA, SMD, CSP, LGA, QFP, PLCC and BGA reballing.

 

7. It can suit for a variety of computer, notebook, play station’s BGA components, especially in a Northbridge/ Southbridge chipset of computer.

 

Technic parameter

 

 

 Instrument inventory

 

 

Operation

 

 

1. Examination and starting:

 

 

 

1) Inspect the infrared lamp body, the temperature sensor and the power line and see if they are in good connection.

 

 

 

2) Turn on the power switch.Self-checking uses (the previous setting value semons trated on the keyboard display monitor after you turn on the machine).

 

3) The front panel has two switches: one controls the preheating dish, the other the infrared lamp separately.

 

 

 

2. Sealing off/repair operation:

 

 

 

1)  Inserting of the PCB board:

 

 

 

Put PCB on the corresponding notch in PCB support, and adjust the pinch nuts of locating ring and fasten with the hand wheel. Make sure the PCB board is in a secured position.

 

 

 

2)  Before starting with sealing off/repair:

 

 

 

Adjusts the PCB board position, so that it’s centre is vertically aligned with the infra red lamp. Adjust the height of infrared lamp body, the ideal height between lamp and the component is 20-30mm.

 

 

 

Place the temperature sensor of the infrared lamp near the chip in a suitable position. If the circuit board is adhered by solid sealing colloid, you can switch on the pre heater plate to melt the colloid. If not, please take other proper measures. The temperature to melt colloid can’t be too high; generally the

 

 

 

ideal temperature should be between 120 to 140 . The preheat interval is approximately 3 - 5 minutes.

 

 

 

3)  Sealing off/repair process:

 

 

 

According to product technological requirement or PCB board size, adjust the temperature of the preheating chassis to about 60-200; switching it on about

 

 

 

3-5 minutes in advance will stabilize the temperature.

 

 

 

Select the suitable heating temperature of infrared lamp between 200-450°C, according to the chip size that need to be unsoldered. For general guidance: According to the chip size, adjusts the infra-red lamp temperature to about 22mm  and the preheating chassis temperature to about60-200 .

 

 

 

When you unsolder chips which are smaller than 20 x 20 mm, you adjust the infrared lamp’s temperature to 220-240  .

 

 

 

When working on bigger chips like 30x30mm, according to your experience, you may adjust the infra-red lamp to 240-260  ; preheat the dish to about 140-200  first for 3 - 5 minutes. Once the temperature has  stabilized, you may complete the sealing off/repair process very conveniently. Please pay attention to the timing to prevent the chip from burning out.

 

 

 

4) Soldering process

 

 

 

Clean up the welding plate with the brush. Put the tin ball and spread soldering flux (not too thick, only a thin layer of it) on the soldering plate. Put the chip in the accurate place after the solvent volatilizes out of soldering flux, heat the tin ball until it melts, once the tin ball melts, the chip will be soldered in the right place automatically. Pick out the PCB to check if the chip works after it cools down. If not, solder it again.

 

 

 3. Maintenance and overhaul:

 

 

 

1)   Complete machine maintenance:

 

 

 

After the machine has been used for a period of time, clean the focusing frame, the guide rod, the PCB board support and the sliders and treat them with a lubricant to protect them from rust.

 

 

 

2)  Preheating chassis and infra-red lamp body maintenance:

 

 

 

Clean the pre heating chassis and in particular the infrared lamp body with dehydrated alcohol. Otherwise residue from evaporated soldering paste could otherwise decrease the effectiveness of the infrared lamp.

 

 

 

3)  Infra-red lamp replacement:

 

 

 

Use a special inside caliper gauge or a pair of long mouth pliers to first take out the inside spring. Then push the lamp gently out of the body through the air vent.

 

Warranty:

 

 The complete machine has a warranty period of 1 year from the time of purchase and lifelong service support as well as a long-term factory price supply.

 

 

 

The life of the infrared lamp should be around 1000 working hours, guaranteed usable for 3 months. We provide online Q/A and troubleshooting support and technical advice service.

 

 

 

Want to know more information, don't hesitate, please contact me as soon as possible

Joyce skype:  qiao.joyce

Sincerely look forward to the cooperation with you !

Yours Friend Joyce