1. Polishing Material specification for WF-20A polisher:

Remark :User should use the recommended polishing liquid and polishing films for WF-20A polisher. We could not ensure the polishing quality meet user’s requirements if other types of polishing liquid and films were used.

2. PC/UPC (R20) Standard Polishing Results

PC/UPC(R20)

Polishing Process:      4 processes (not including “Remove Glue ”)

Return Loss :          ≥50 dB

Top Curvature:        10~25 mm

Top Excursion:         ≤50 nm

Core Hollow :          ≤0.1 um

Surface Roughness :    ≤50 nm

3. General Technical Parameters

Machine Size:              L 240(mm) × W 240(mm) × H 260(mm)

O.D. of Rotation Plate:        127 mm(5 inch)

Time Settings :               99 min 99 sec (Max)
Speed for Rotation Plate :     90 rpm

Height of Plate Jumpiness :    <10 um

Pressure Configuration:        21 ~ 36 N/cm²

Work Temperature :          10 ~ 40 Celsius degrees 

Relative Humidity :         15%~85%

Noise :                      unloading Less 50 dB

Libration :                  Working Status 0.25g 5~100Hz 10min

Stopping Status 0.50g  5~100Hz  10min

Power Input:             220~230 VAC 50Hz/60Hz

Electric Power :                40 W

Net Weight /:                   24 kg

4. Storage Condition

Temperature :           -40 ~ 80 Celsius degrees / -40℃~85℃

Relative Humidity :      15%~85%

Libration :           1.0g 5~100Hz 45min

5. Options for Polishing jigs

Remark : If you could not find the jig's models you look for, please contact with us.