Product Details

Specifications

1, the good quality with competitive price;
2, Soldering pot is to remove and install most through-hole devices on PCBs;

APPLICATIONS

This inexpensive bench-top removes or installs through-hole components on SMT boards without damage to adjacent devices. It will process ICs, including DIPs, QFPs, PGAs, connectors and odd forms without reliance on slow, labor-intensive manual methods. The Mini Wave is ideal for short-runs requiring precision and repeatability. Simple to use, the operator first sets the soldering temperature desired from 0° to 400°C covering any tin/lead or lead-free thermal requirement. The correct nozzle is then selected from the 3 that are included, with many additional custom nozzles also available. The wave is activated by an on/off switch while Z-motion wave immersion and dwell time is governed by foot switch. Component removal occurs when solder bonds are fluidized, allowing the operator to extract the component from the PCB. A replacement device can then be placed on the PCB. After prefluxing, the nozzle is positioned allowing soldering to take place.

FEATHERS

1. Removes and installs most through-hole devices on PCBs, without damage to adjacent surface mount components.

2. A compact, easy-to-use, low-cost machine with fast payback realized from labor savings alone.

3. Lead or lead-free compatibility, Temperatures adjustable to 400°C.

4. Wave is directly controlled by manual switch; solder bath dwell time controlled by foot pedal.

5. Includes customer's choice of 3 component nozzles from a total of 24 sizes available (see "Nozzles").

SPECIFICATIONS

1. Power: 220V AC/60Hz 1.2Kw

2. Dimension: 420*400*300mm

3. Temperature Range: 0 to 399°C

4. Solder Capacity: 40kg

NOZZLES SPECIFICATIONS

Nozzle #	Dimensions	Nozzle #	Dimensions
1	20mm x 40mm	13	50mm x 50mm
2	60mm x 60mm	14	50mm x 80mm
3	15mm x 120mm	15	60mm x 80mm
4	15mm x 30mm	16	10mm x 60mm
5	20mm x 50mm	17	10mm x 80mm
6	20mm x 80mm	18	10mm x 100mm