Specifications

x-ray system designed to address the inspection needs of BGA, CSP, flip Chip, semiconductors, and multi-layer board registration

X-Ray inspection system

 

SAM is a high resolution x-ray system designed to address the inspection needs of BGA, CSP, flip Chip, semiconductors, and multi-layer board registration. SAM has created the HT for process development, process monitoring and ongoing support of the rework and repair function.

The SM is a "batch" or manual type of x-ray system, it includes a Windows based workstation (HT-100) w ith multiple image processing functions for real time measurement and data collection. SAM has combined ease of use, excellent image quality and low price in the development and introduction of the SM

 

 System features

 

1,Up to 100 kV,130KV,5 micron ( typical ) focal spot x-ray tube producing 125X geometric magnification, plus     optical   zoom for an additional 600X magnification.

2, Field of view range1.5mm to 50mm (typical) (.05" to 2")

3, Laser pointer for visual correlation.
4,Zaxis control of x-ray source (FOV and magnification control).
5,Zaxis movement of x-ray detector (FOV and magnification control).

 

Physical Dimensions                               Positioning System

Dimensions: H: 69" (with antenna 80") W:56" L:45". Weight: 700kg (17001bs). Table Load Height: 900mm(36"). Motorized XY positioning, total scan    area:450mmx400mm(18" x 16" ). Motorized Z axis positioning of x-ray tube. Variable Z axis positioning of x-ray detector

 

X-Ray tube specifications                      Image intensifier Specifications

Energy: 0 - C 100 kV (80 & 100kV options)   Power: 10 Watts   Focal Spot Size: 5-10 micron ( 7 micron typical )   X-ray Tube Style: Sealed tube with end    window design

Detector Type: 4/2" Dual Field Image intensifier   Camera: CCD with 6:1 ratio zoom lens &    iris      control (optional).