• Recommended for masking circuit boards and splicing wires.
• Polyimide film with silicone adhesive for easy release.
• Flame retardant.

No.

Item name

Unit

Standard

1

tensile strength≥

Mpa

70

2

elongation ratio≥

%

30

3

bottom material adhesion force before and after solidification≥

N/25mm

1.5

4

copper material adhesion force before and after solidification≥

N/25mm

1.5

5

electric strength≥

Mv/m

70