Product Details

Lasing diode/MCM/CPU components tungsten copper heat sinks

They are composites of tungsten and copper. So both the thermal advantages of copper and the very low expansion characteristics of tungsten can be utilized.
By adjusting the content of tungsten, we can have its coefficient of thermal expansion (CTE) designed to match those of materials such as ceramics (Al2O3, BeO), semiconductors (Si), and metals (Kovar), etc.

Our products are widely used in applications such as optoelectronics packages, Microwave Packages, C Packages, Laser Submounts.

Used as Thermal mounting plates,chip carriers,flanges, frames for RF and substrates etc.

Advantages

1.High thermal conductivity

2.Excellent hermeticity

3.Excellent flatness, surface finish, and size control

4.Semi-finished or finished (Ni/Au plated) products available

5.CTE closely controlled to match ceramics (Al2O3, BeO), semiconductor (Si), metals like Kovar, etc.

Properties

Content (wt%)	Cu (wt%)	W (wt%)	Density (g/cm³)	Coefficient of thermal conductivity (W/m2.K)	Coefficient of thermal expansion (×10-6/K)
WCu10	10±2	the rest	16.8	160-180	6.3-6.8
WCu15	15±2	the rest	16.1	180-200	7.0-7.5
WCu20	20±2	the rest	15.2	190-210	8.0-8.5
WCu25	25±2	the rest	14.5	200-230	9.0-9.5
WCu30	30±2	the rest	13.80	-240	-9.7

Applications

As a copper tungsten material, it’s a composite. So both the thermal advantages of copper and the very low expansion characteristics of tungsten can be utilized.
The combination of these two materials results in thermal expansion characteristics similar to those of silicone carbide, aluminum oxide, and beryllium oxide, used as chips and substrates.
Tungsten copper heat sinks are extensively used in thermal mounting plates, chip carriers, flanges, and frames for RF, microwave millimeter wave packages like LDMOS FET; MSFET; HBT; Bipolar; HEMT; MMIC, light emitting diodes and detectors, laser diode packages like pulse, CW, single emitter, bars and complex carriers for optoelectronics amplifiers, receivers, transmitters, tunable

Service we can off you

1.Quick Response:Your inquiry will be replied within 24 hours.

2.High Quality:Well-trained workers and more than 15 years experience.

3.Competitive Price:Directly from factory to save your money.

4.Short Lead Time:Being efficient:3-5 days for samples and 10-20 days for quantity orders.

5.Flexibility:Small orders are acceptable for quick delivery and to help you reduce stock cost.

6.OEM&ODM:Custom fabrication according to your drawings ,samples or designs.

We can offer various type with different functions for customers, not only manufacture according to the international standard, but also can design as per the requirements of customers.

Please choose freely from the wide range of already available Lasing diode/MCM/CPU components tungsten copper heat sinks or contact us with your specifications.

Products display