Product Details

Specifications

1.power bank pcb
2.HASL,ENIG,Plating gold,etc.
3.1-10 layer board
4.UL,SGS,ROHS,CE Certificate

1.UL, SGS Test, RoHS Certification, ISO9001:2008
2.1-16 layer:FR-4, Alu pcb
3.Short lead time
4.10 years factory

We can do for you:

1-16 layer FR-4 PCB board, 1-2 layer Aluminum PCB

1-6 oz copper thickness

0.2 mm hole size

0.1 mm track width/space

Our PCBs are used for wide range of electronic products,

Like Medical devices, CCTV, Power supply, GPS, UPS, Set-top Box,

Telecomunication ,LED, etc.

Factory Manufacture Capability.

Item	Manufacture Capability
Material	FR-4 / Hi Tg FR-4 / Lead free Materials (RoHS Compliant) /CEM-3, Aluminium, Metal based
Layer No.	1-16
Finished Board thickness	0.2 mm-3.8mm’(8 mil-150 mil)

Board Thickness Tolerance	±10%
Cooper thickness	0.5 OZ-11OZ (18 um-385 um)
Copper Plating Hole	18-40 um
Impedance Control	±10%
Warp&Twist	0.70%
Peelable	0.012"(0.3mm)-0.02’(0.5mm)
Images
Min Trace Width (a)	0.1mm (4 mil)
Min Space Width (b)	0.1mm (4 mil)
Min Annular Ring	0.1mm (4 mil)
SMD Pitch (a)	0.2 mm(8 mil)
BGA Pitch (b)	0.2 mm (8 mil)

Solder Mask
Min Solder Mask Dam (a)	0.0635 mm (2.5mil)
Soldermask Clearance (b)	0.1mm (4 mil)
Min SMT Pad spacing (c)	0.1mm (4 mil)
Solder Mask Thickness	0.0007"(0.018mm)
Holes
Min Hole size (CNC)	0.2 mm (8 mil)
Min Punch Hole Size	0.9 mm (35 mil)
Hole Size Tol (+/-)	PTH:±0.075mm;NPTH: ±0.05mm
Hole Position Tol	±0.075mm
Plating
HASL	2.5um
Lead free HASL	2.5um
Immersion Gold	Nickel 3-7um Au:1-5u''
OSP	0.2-0.5um
Outline
Panel Outline Tol (+/-)	CNC: ±0.125mm, Punching: ±0.15mm
Beveling	30°45°
Gold Finger angle	15° 30° 45° 60°
Certificate	ROHS, ISO9001:2008, SGS, UL certificate

Our Factory Manufacture Capability