Item

Manufacture Capability

Material

FR-4 / Hi Tg FR-4 / Lead free Materials (RoHS Compliant) /CEM-3, Aluminum, Metal based

Layer No.

1-- 20

Finished  Board thickness

0.2 mm-4.0mm’(8 mil-160 mil)

Board  Thickness Tolerance

±10%

Cooper thickness

0.5 OZ-6OZ (18 um-210 um)

Copper Plating Hole

18-40 um

Impedance Control

±10%

Warp &Twist

0.50%

Peelable

0.012"(0.3mm)-0.02’(0.5mm)

Images

Min Trace Width

0.075mm (3mil)

Min Space Width

0.075mm (3mil)

Min Annular Ring

0.1mm (4 mil)

Solder Mask

Min Solder Mask Dam

0.0635 mm (2.5mil)

Solder mask Clearance

0.1mm (4 mil)

Holes

Min Hole size (CNC)

0.1 mm (4 mil)

Min Punch Hole Size

0.9 mm (35 mil)

Hole Size Tol (+/-)

PTH:±0.075mm;NPTH: ±0.05mm

Hole Position Tol

±0.075mm

Plating

HASL

2.5um

Lead free HASL

2.5um

Immersion Gold

Nickel  3-7um  Au:1-5u''

OSP

0.2-0.5um

Certificate

ROHS, SGS, UL, ISO9001: 2008.