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Product Details

TI AM1808 System On Module Board Specifications

Core Module is designed by six floors of PCB high precision process, and has the best electrical properties and anti-jamming performance; together with CPU,DDR2,NandFlash,PHY network chip,crystal oscillator etc. Through the high quality B2B connector leading to 200 signal pin, which is fully extended all the hardware resources of AM1808, the user can reuse pins to combine different interfaces, and customize the actual needs of the base board.

TI AM1808 System On Module Board Specifications

CPU Processor
• TI AM1808 CPU, ARM926EJ-S Core
• 456MHz

SDRAM Memory
• 128MB SDRAM

FLASH Storage
• On-board 128M*8bits NandFlash(could change a large capacity or industrial chip according to customer's requirement)

Interfaces
• 2 pieces 2*50PIN B2B connectors: simple, convenient, high reliability

Other Onboard Resources
• On-board LAN8720 network chip, support 10M/100M Ethernet with MII mode

PCB Specification & Size
• Using six floors of PCB high precision process, and has the best electrical properties and anti-jamming performance
• 74 x 53 x 1.5mm

Working Parameters
• Working temperature: -20°C~ 70°C (batch user could customize -40°C~ 85°C)
• Humidity Range: 5%~ 95%, Non-Condensing

Low Power Consumption
• 5v Dc power supply, low power consumption, <2W

Support OS
• Linux2.6.33
• WindowsCE 6.0

TI System On Module Board Technical Support:

• The problems that customer encounter in the process of development on the products
• System cut, according to customer's requirements
• Develop related drivers, according to the demand of customer(another pay)
• Customized development of back plane, according to customer's requirements(another pay)

TI AM1808 Embedded System On Module Board Order Infomation

Item	QY-1808P
DVD resources	Linux	Compilers	Cross-compiler arm-arago-linux-gnueabi-gcc
		Tool software	Supporting terminal, writing, download tools
		Device manual	Main components' datasheet of back plane
		User manual	About all development and use
		Image file	Bootloader, kernal, image file of file system
		Test source code	Test routines and source codes of all interfaces
		System source code	Include Bootloader, kernel, file system and QT source code
	Windows CE	Tool software	Supporting terminal, writing, download tools, sync software
		Device manual	Main components' datasheet of back plane
		User manual	About all development and use
		Image file	Firstboot, Eboot, NK image file
		Test source code	Test routines and source codes of all interfaces
		BSP package	Related BSP board-level supporting package
		SDK	Related SDK
Module options(another pay)	TTL to LVDS module
Module options(another pay)	TTL to VGA module
Sales hotline	0571-87858811,87858822

System On Module Board Application:

• Textile Industry, Numeric Control Industry, Automobile Electronics, Industrial Touch Screen Control System, Robot Vision, Media Deal Wireless Application, Digital Applicance, On-board Equipment, Communication Equipment, Network Terminal, etc.