Product Details

Conformable with very low compression forces Thermal grease for CPU

Benefits:

Conformable with very low compression forces

Will not cause corrosion on any metal surface

Introduction:

G500 is a highly conformable/thermally conductive, high viscosity type silicone compound. It provides a thermal solution for the recent trends of integrating higher frequency electronics into smaller devices. G500 easily forms and adheres to most surfaces, shapes, and sizes of components.

Features

.Thermal conductivity: 2.0/3.0/5.0 W/M-K

. Low thermal resistance

. RoHS & UL compliance

Applications

. CPU and Chipset cooler

. Switching mode power

. Electronic Home compliance

. LED industry

. Others

Store Method:

. This item can be saved for 18 months when it is sealed under room temperature 25°C.

Physical Properties:

PROPERTY	G-200	G-300	G-500	TEST METHOD	UNIT
Density	2.3	2.7	3.2	ASTM D792	---
Color	Gray	Gray	Gray	---	Visual
Volatile Content	0.5	0.3	0.2	ASTM E595	%/Wt
Thermal Conductivity	2.0	3.0	5.0	ASTM D5470	W/mK
Thermal Resistance	0.041	0.025	0.009	ASTM D5470	C-In2/W
Breakdown Voltage	1100	1000	600	ASTM D149	VAC/mil
Dielectric Constant	4.5	4.7	4.8	ASTM D150	---
Volume Voltage	>1013	>1013	>1012	ASTM D257	---
Work Temp	-50°C to 200°C

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