K4B1G0846G-BCK0(SamsungSemiconductor)Original
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Home -Product -Mobile Memory
Mobile DRAM and Multi-Chip Packages (MCPs)
SamsungMobile memory enables outstanding design flexibility. Mobile DRAM solutions help designers create sleek devices with heightened functionality. And, innovative "chip-stack" MCP solutions optimize board space by combining different memory technologies on a single substrate.
1. temperature
2. speed for Mobile-SDRAM
Part No. Suffix | Description |
C3 | 133MHz, CL3 |
C6 | 166MHz, CL3 |
C8 | 200MHz, CL3 |
CA | 111MHz, CL3 |
ICC1 @ Max.frequency, CL33. mobile function
4. current
5. lead-free & halogen-free package
2 : 90FBGA (DDP)
3 : 90FBGA (lead-free & halogen-free, DDP)
4 : 96FBGA
5 : 96FBGA (lead-free & halogen-free)
7 : 90FBGA
8 : 90FBGA (lead-free & halogen-free)
A : 168FBGA (lead-free, halogen-free, DDP)
F : 60FBGA (lead-free & halogen-free)
M : 152FBGA (lead-free & halogen-free, POP)
N : 168FBGA (lead-free & halogen-free, POP)
P : 60FBGA (lead-free & halogen-free, DDP)
Y : 60FBGA (DDP)
Mobile DRAM
High-speed, power-saving memory for the next generation of mobile devices
Find out why leading manufacturers utilize Mobile DRAM for eBooks, tablet computers, smart phones, MP3s, and PDAs. Deliver the features you need to confidently meet market demand for handheld devices with high-performance memory built specifically for the leading edge of mobile device and application design.
Gain exceptional design advantages
Benefits of using Mobile DRAM in computing, consumer, and communication devices include:
Realize outstanding power savings
Boost battery life with new generations of Samsungmobile memory:
Our LPDDR2 and LPDDR3 are designed to extend the life of a seven-hour battery by about 45 minutes during typical mobile operation. For standby power, the savings are even more dramatic. For example, Samsungs LPDDR2 or LPDDR3 can add up to three days of standby battery life for a smart phone, which is a 23 percent improvement over LPDDR1 - from 12.5 to 15.4 days.
Take mobile electronics to new heights
Accelerate your time to market with advanced Mobile DRAM. Whether you are designing with tight space constraints or need a game-changing combination of low power and high performance, depend on to deliver leading solutions for an ever-changing market.*
Innovative "chip-stack" design optimizes board space
Find out why leading manufacturers choose SamsungMulti-Chip Packages (MCPs) for applications where board space is extremely limited, such as smartphones and other mobile handsets, tablets, and multimedia players. MCP memory configurations are designed to support a growing list of device capabilities, expanding freedom and choice for users who want to do more with their mobile applications.
SamsungMCPs combine different memory technologies, including single-level cell (SLC) NAND flash or eMMC and Mobile DRAM such as LPDDR1 (low-power DDR1) and LPDDR2 on a single substrate. This flexible approach is designed to deliver benefits including:
The broad Samsung MCP portfolio includes a myriad of memory configurations, primarily with 2-, 3-, or 4-die packages. The most popular combinations are 1Gb+512Mb; 2Gb+1Gb; 4Gb+2Gb (NAND and Mobile DRAM); as well as new eMMC-based MCP (eMCP) combos such as 4GB eMMC + 4Gb MDDR, and 32GB eMMC + 8Gb LPDDR2. The newest-generation eMCP modules are designed to contain a combination of the fastest eMMC (embedded multimedia card), along with either MDDR or LPDDR2 memory.
SamsungMCPs optimize designs for a comprehensive range of new and evolving consumer electronic devices.
For virtually any mobile phone, Samsungoffers a mass-produced MCP solution to enable the desired feature set. In fact, Samsunghas been qualified in many reference designs from top-tier chipset vendors. In addition, Samsungcan produce custom MCPs quickly to help meet demanding design schedules.
SamsungMCPs help you stay ahead of the competition in the fast-moving mobile device market. With minimized power consumption, small size, and high memory density, SamsungMCP solutions offer the memory foundation to build a full spectrum of high-end consumer electronic devices. Use Samsunghigh-density MCPs to capitalize on the growing trend for powerful multimedia applications and wireless Internet support that today's consumers expect from their portable devices.
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Manufacturer Part Number: |
K4B1G0846G-BCK0(SamsungSemiconductor)Original |
Manufacturer / Brand: | Original Brand |
Quantity Available: | 20386(contact us to confirm the available quantity) |
Unit Price: | Contact us |
D/C (Date Code): | Generally newest 2014+ |
Lead Time (Delivery Time): | IN STOCK, Fast delivery |
Condition: | NEW AND UNUSED, ORIGINAL FACTORY PACKING |
Package / Case: | FBGA |
Packaging: | Factory sealed packing |
SPQ (Standard Package Quantity): | Contact us |
MOQ: | 20Piece |
Datasheet Download: | Contact us Contact: winwin-ke@hotmail TradeManager:winchips /skype:win-chips |
Factory sealed packing,and sended in the following types: Tube, Tray, Tape and Reel, Bulk packing, Bag, etc. Please kindly confirm with your sales if you need any other assistant or demand.
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