Specifications

Specifications:

Features:
1. Choose imported high-precision materials (temperature sensor, heater) to control the BGA desoldering & soldering procedures precisely.

2. There are three independent heating areas from top to bottom. the first and second temperature areas can control many groups & sections of temperature parameters at the same time. The third area preheats the PCB thoroughly to achieve the best welding effect.

3. Choose imported high-precision thermocouple to detect top/down temperature precisely. With a function of over-temperature protection.

4. Top & bottom temperature areas heat independently, A cross-flow fan cools rapidly to protect the PCB from deformation when welding.

5. After finishing desoldering & soldering, there is an alarming. The machine is equipped with a vacuum suction pen to facilitate the removing of BGA after desoldering.

6. Use a V-groove equipped with a flexible fixture for PCB positioning to protect the PCB.

7.For large thermal capacity of PCB or other high-temperature and lead-free welding requirements, all can be handled easily.