Specifications

ZM-R5860C Hot Air BGA Rework Station

 1. Main Features:

1.  Adopt linear slide which makes X, Y, Z axis all can do micro adjust or rapid positioning, with high precision, within ± 0.01MM, easy operation.

2.  3 independent heaters area. The 1st and 2nd hot-air heaters can set multiple groups and segments temperature parameters. The 2nd heater can move up and down. The 3rd large area IR heater can preheat the PCB board fully to ensure no deformation to the board.

3.High-precision K-type thermocouple with closed loop control, PID auto-tuning temperature system, combined with highly sensitive temperature module for the precise temperature control, the temperature error controlled within ± 2 degree

4.The External sensor can detect temperature precisely, analyze and calibrate the real temperature curve accurately.

5. V-groove , Flexible and removable universal fixture has protective effects and no damage to the PCB board, suitable for all kinds of BGA repair.

6. Alloy BGA nozzles, 360 degree rotation, easy to install and replace, offer customized service. 

7.  Laser positioning function is optional,with High-definition CCD color optical vision system

8. You can clearly observe all aspects of the BGA chip through the Optical lens moving freely and manually. Equipped with 15 inch TFT LCD Monitor.

9.CE certification,ensure the quality.  

2. Specifications:

3. Packing List: