Specifications

1.PCB design and assembly
2.Engineering service
3.UL.CE.FCC.Rohs approval
4.Various size
5.1-12layer

PCBA Serive.

 

Technique requirement:

 

1) Professional Surface-mounting and Through-hole soldering Technology

2) Various sizes like 1206,0805,0603 components SMT technology

3) ICT(In Circuit Test),FCT(Functional Circuit Test) technology.

4) PCB Assembly With UL,CE,FCC,Rohs Approval

5) Nitrogen gas reflow soldering technology for SMT.

6) High Standard SMT&Solder Assembly Line

7) High density interconnected board placement technology capacity.

 

 

Multi-layer PCB Specification
providing you one-stop pcb assemblies service.
1	Layer	1-12 layer
2	Material	FR-1,FR-2,FR-4,CEM-1,CEM-3,Hight TG,FR4 Halogen Free,
3	Board thickness	0.2mm-3.5mm
4	Max panel size	630mm*520mm
5	Min.drilled hole size	0.5mm
6	Min.line width	0.075mm(3mil)
7	Min.line spaceing	0.075mm(3mil)
8	Surface finish/treatment	HASL/HASL lead free,Chemical tin,Chemical Gold,Immersion gold Inmersion Silver/Gold,Osp,Gold Plating
9	Copper thickness	0.5oz Min.,5.0oz Max
10	Solder mask color	green/black/white/red/blue/yellow
11	Inner packing	Vaccum packing,Plastic bag
12	Outer packing	standard carton paking
13	Hole tolerance	PTH:±0.076,NTPH:±0.05
14	Certificate	UL,ISO9001,ISO14001,ISO/TS16949,ROHS
15	profiling punching	Routing,V-CUT,Beveling

 

 

More relative pictures: