Specifications
Made control mother pcba for sd carder pcba board- Quality garanteed
- Flexible production
- AOI and visual inspection
SD card reader pcb assembly manufacturer
PCBA PCB Full assembly capability
- Full experienced QC and inspector
- Strong sourcing ability in relative parts and components
- Experienced technical staffs in charge of product design
- Circuit boards 1 to 28 layers PCB layout, fabrication, PCB assembly and box build
- Enclosure cabinet case plastic injection molding, metal stamping, manufacturing and assembly
- High-precision E-Tesing include: ICTin circuit, function tesst, etc.
PCBA Packaging
Items per Carton: 100 Pieces/Carton
Gross Weight: 20.0kg
Package Type: 1pcs/ ESD bubble bags k=k honey carton box
Please keep reading the following about our services
- PCB Layout Design and Assembly
- PCBA Assembly
- electronic Product OEM/ODM
- Computer pcba
- ID Design
- Mechanic Design
- Packing Design
- Final Product Assembly
| Item | Manufacturing Capability |
| Material | FR-4 / Hi Tg FR-4 / Lead free Materials (RoHS Compliant) /CEM-3, Aluminium, Metal based |
| Layer No. | 1~12 layers |
| Finished Board thickness | 0.2 mm-3.8mm’(8 mil-150 mil) |
| Board Thickness Tolerance | ±10% |
| Cooper thickness | 0.5 OZ,1.0OZ,1.5OZ and 2 OZ (18 um-75 um) |
| Copper Plating Hole | 18-40 um |
| Impedance Control | ±10% |
| Warp&Twist | 0.007 |
| Peelable | 0.012"(0.3mm)-0.02’(0.5mm) |
| Min Trace Width | 0.1mm (4 mil) |
| Min Space Width | 0.1mm (4 mil) |
| Min Annular Ring | 0.1mm (4 mil) |
| SMD Pitch (a) | 0.3 mm(12mil) |
| BGA Pitch (b) | 0.3 mm (12mil) |
| Min Solder Mask Dam (a) | 0.0635 mm (2.5mil) |
| Soldermask Clearance (b) | 0.1mm (4 mil) |
| Min SMT Pad spacing (c) | 0.1mm (4 mil) |
| Solder Mask Thickness | 0.0007"(0.018mm) |
| Min Hole size (CNC) | 0.2 mm (8 mil) |
| Min Punch Hole Size | 0.9 mm (35 mil) |
| Hole Size Tol (+/-) | PTH:±0.075mm;NPTH: ±0.05mm |
| Hole Position Tol | ±0.075mm |
| HASL | 2.5um |
| Lead free HASL | 2.5um |
| Immersion Gold | Nickel 3-7um Au:1-5u'' |
| OSP | 0.2-0.5um |
| Panel Outline Tol (+/-) | CNC: ±0.125mm, Punching: ±0.15mm |
| Beveling | 30°45° |
| Gold Finger angle | 15° 30° 45° 60° |
Our application engineers welcome the opportunity to assist you in developing products to fit your particular applications.Pride in workmanship is our goal and striving to achieve 100% customer satisfaction .From the moment your order arrives,our dedicated staff of professionals guarantees the success of your project.
Production line& Machine
Manufacturing capability
- PCBA Size: 457x567cm(max);4x3cm(Min)
- IC Pitch(min):0.2mm
- Chip Size(min):0402 /1005(1.0x0.5mm)
- BGA Size:8x6mm~37x37mm
- BGA Pin Count: 48pin~600pin
- Package: SOP/SSOP/PLCC/QFP/QFN/BGA/FBGA/u-BGA
- u-BGA Ball diameter: 0.2mm
Main Markets:
Domestic Market
Western Europe
Eastern Asia
Mid East
Oceania
Africa
Southeast Asia
Eastern Europe
South America
North America
Trade Term:
1. Payment: T/T, LC,DA,DP,Paypal.
2. Lead time: 10 working days for normal products
3. Samples can be available within 8~10working days
4. Shipping freight is quoted under your requests
5. Shipping port: Shenzhen or HongKong