Specifications

Made control mother pcba for sd carder pcba board
- Quality garanteed
- Flexible production
- AOI and visual inspection

SD card reader pcb assembly manufacturer

  

PCBA PCB Full assembly capability

- Full experienced QC and inspector

- Strong sourcing ability in relative parts and components

- Experienced technical staffs in charge of product design

- Circuit boards 1 to 28 layers PCB layout, fabrication, PCB assembly and box build

- Enclosure cabinet case plastic injection molding, metal stamping, manufacturing and assembly

- High-precision E-Tesing include: ICTin circuit, function tesst, etc.

PCBA Packaging

Items per Carton: 100 Pieces/Carton

Gross Weight: 20.0kg

Package Type: 1pcs/ ESD bubble bags k=k honey carton box

  

Please keep reading the following about our services

- PCB Layout Design and Assembly

- PCBA Assembly

- electronic Product OEM/ODM

-  Computer pcba

- ID Design

- Mechanic Design

- Packing Design

- Final Product Assembly

Item	Manufacturing Capability
Material	FR-4 / Hi Tg FR-4 / Lead free Materials (RoHS Compliant) /CEM-3, Aluminium, Metal based
Layer No.	1~12 layers
Finished Board thickness	0.2 mm-3.8mm’(8 mil-150 mil)
Board Thickness Tolerance	±10%
Cooper thickness	0.5 OZ,1.0OZ,1.5OZ and 2 OZ (18 um-75 um)
Copper Plating Hole	18-40 um
Impedance Control	±10%
Warp&Twist	0.007
Peelable	0.012"(0.3mm)-0.02’(0.5mm)
Min Trace Width	0.1mm (4 mil)
Min Space Width	0.1mm (4 mil)
Min Annular Ring	0.1mm (4 mil)
SMD Pitch (a)	0.3 mm(12mil)
BGA Pitch (b)	0.3 mm (12mil)
Min Solder Mask Dam (a)	0.0635 mm (2.5mil)
Soldermask Clearance (b)	0.1mm (4 mil)
Min SMT Pad spacing (c)	0.1mm (4 mil)
Solder Mask Thickness	0.0007"(0.018mm)
Min Hole size (CNC)	0.2 mm (8 mil)
Min Punch Hole Size	0.9 mm (35 mil)
Hole Size Tol (+/-)	PTH:±0.075mm;NPTH: ±0.05mm
Hole Position Tol	±0.075mm
HASL	2.5um
Lead free HASL	2.5um
Immersion Gold	Nickel  3-7um  Au:1-5u''
OSP	0.2-0.5um
Panel Outline Tol (+/-)	CNC: ±0.125mm, Punching: ±0.15mm
Beveling	30°45°
Gold Finger angle	15° 30° 45° 60°

      Our application engineers welcome the opportunity to assist you in developing products to fit your particular applications.Pride in workmanship is our goal and striving to achieve 100% customer satisfaction .From the moment your order arrives,our dedicated staff of professionals guarantees the success of your project.

Production line& Machine

Manufacturing capability
- PCBA Size: 457x567cm(max);4x3cm(Min)
- IC Pitch(min):0.2mm
- Chip Size(min):0402 /1005(1.0x0.5mm)
- BGA Size:8x6mm~37x37mm
- BGA Pin Count: 48pin~600pin
- Package: SOP/SSOP/PLCC/QFP/QFN/BGA/FBGA/u-BGA
- u-BGA Ball diameter: 0.2mm   

Main Markets:

Domestic Market
Western Europe
Eastern Asia
Mid East
Oceania
Africa
Southeast Asia
Eastern Europe
South America
North America

Trade Term:

1. Payment: T/T, LC,DA,DP,Paypal.

2. Lead time: 10 working days for normal products

3. Samples can be available within 8~10working days

4. Shipping freight is quoted under your requests

5. Shipping port:  Shenzhen or HongKong