ACF bonding machine CWPC-1A
USD $1 - $2 /Set
Min.Order:1 Set
Dongguan Chuangwei Electronic Equipment Manufactory
ACF bonding machine CWPC-1A ,Hot bar soldering machine
Technical parameters for ACF bonding machine :
Model | CWPC-1A |
Machine Size | 620mm X 690mm X 570mm |
Work Area | 200mm X 260mm |
Air pressing | 0.45-0.70Mpa |
Machine Weight | 95KG |
Temperature setting
| 20-500 C |
Bonding time
| 1-99s |
Temperature precision
| +-2 |
bonding force
| 0.1-0.6Pa |
Precision
| 0.05 Pa |
Fixture | 1 set |
Features for ACF bonding machine :
Pulse-Heated Soldering Machine with Pneumatic Rotary Turntable CWPC-1A
1.Extremely short cycle time with rotary table design. Product loading and unloading can be done during the heat sealing process
2.High quality heat seal application up to 0.25mm pitch
3.Pneumatic bonding head provide up to 3,900N force
4.Digital programmable pressure control with LCD display
5.Closed loop PID temperature control with visible LED display
6.Bonding cycle is triggered by a real time pressure sensor
7.Floating Thermode ensure consistent pressure and heat transfer along the flexfoil to LCD and/or PCB
8.Precision product fixtures (2X), easy exchange, provided with micrometer alignment and vacuum to fix components
9.Optional CCD alignment module with frame, camera, lens, monitor and illumination for fine pitch application
10.Full microprocessor logic control
Our customers :