Hot-bar Soldering and bonding

Hot-bar Soldering and bonding

Hot-bar Soldering and bonding

Specifications for  Hot-bar Soldering and bonding

Chuangwei  pcb fpcHot Bar Soldering solder
1.use pulse heat with linear guide moving 
2,apply to TAB,TCP,ACA and FPC,FFC,PCB etc. 

Chuangwei  Hot-bar Soldering and bonding
1.use pulse heat with linear guide moving
2,apply to TAB,TCP,ACA  and FPC,FFC,PCB etc.

Chuangwei  Hot-bar Soldering and bonding
Technology parameters

Chuangwei  Hot-bar Soldering and bonding
Feature: 

1.Closed Loop PID temperature control with visible LED display

2.LCD display programmable pressure switch for precise force control

3.Each heating cycle is triggered by a real time pressure sensor

4.Floating thermode ensures consistent pressure and heat transfer   
  between the thermode head and the parts to be joined

5.Silicon rubber can be fitted in bonding Heat Seal Connectors    
  between LCD and PCB

6.Standard workpiece holder is mounted on a linear guideway and  

  designed to allow for easy changeover and repeatable operation 

7.Parts registration is adjusted by micrometer and secured by vacuum   

  lock   

8.Optional CCD system for fine pitch component

Hot-bar Soldering and bonding  certificate: