Specifications

PCB specifications:
1) The materials of copperplate: FR4 CEM-3 94V-0 GE IML
2) Max. spelling board

PCB specifications:
1) The materials of copperplate: FR4 CEM-3 94V-0 GE IML
2) Max. spelling board size: 457 x 762mm, large board size possible upon
    requests
3) Layers single double 4-16 layers
4) Board thickness: 0.2-2.5mm
5) The smallest aperture: 0.2mm
6) The smallest width of line: 0.10mm
7) The smallest distance of line: 0.10mm
8) The smallest SMT jointing plate: 0.3mm
9) Warp permitting value of board surface: +-0.7%
10) The smallest bridge of hinder jointing: 0.10mm
11) Surface craft: HAL flash gold OSP cold contacts immersion gold
12) Special craft: blue or yellow character open hole or taphole
13) Hinder jointing: liquid sensitization glue
14) Skewer head gilt: nickel 5um; gold 0.75um
15) Figuration making: Numerical control mill/opened V trough/rush and cut
16) Solder mask: PSR4000, PSR2200
17) Profile: routing, punching, scoring
18) Inspection: 100% E-test 100% visual inspection, AOI for inner-trace

FPC specifications:
1) Film thickness: PI 25 35 50 75 100um
2) PET: 12.5 25 35 50 75um
3) The thickness of copper: 18 35 50 70 100um
4) The smallest width of line: 0.08mm
5) The smallest distance of line: 008mm
6) The smallest aperture: 0.25mm
7) Max. size: 900 x 600mm
8) Layers and structure: single double 4 layers rigid-flex mix. board
9) Peel strength soldering: >0.7N/mm
10) Soldering: PI 260 degree of Celsius 6s; PET 135 degree of Celsius 5s
11) Flexural resistance: R=7, load 100g > 104
12) Insulation resistance: >100MΩ (500V)
13) Surface craft: gold sin/lead OSP