Specifications

Film thickness PI 25 35 50 75 100um
PET 12.5 25 35 50 75um
The thickness of copper 18 35 50 70 100um

Film thickness PI 25 35 50 75 100umPET 12.5 25 35 50 75umThe thickness of copper 18 35 50 70 100umThe smallest width of line 0.08mmThe smallest distance of line 008mmThe smallest aperture 0.25mmMax. size 900*600mmLayers and structure single double 4 Layers Rigid-Flex mix.boardPeel strength soldering >0.7N/mmSoldering PI 260 degree of Celsius 6sPET 135 degree of Celsius 5sFlexural resistance R=7 Load 100g > 104Insulation resistance >100M ohm(500V)Surface craft Gold Sin/lead OSP