Specifications

Alumina Ceramic Substrate
high compressive strength
use temperature up to 2400 degree
wear resistance

Alumina Ceramic Substrate

 

 

For this plate/board,mainly the alumina content is 75-99%.It has the features of high reliability,high density power,high thermal conductivity,high insulation and cycling performance.Dimensions can be formed be mould stamping or laser cutting, it is used in thick film circuit,large-scale integrated circuit,hybrid IC,semiconductor package,chip resistor and other electronic industry fields.

 

Metallization: Could coat with Copper/Gold/W+Mn Etc.and DBC customized designs!

 

 

Alumina Ceramic Substrate Technique Datas:

 

 

Alumina Ceramic Substrate Photos:

 

 

Any question, pls feel free to contact Joanna:

Tel.:    +86-731-23181339

Fax:    +86-731-23181337 

Phone:  +86-15869740474 

Mail:  export5 @

MSN:   fqporcelain @

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