Specifications

Alumina Plate Substrate
high hardness
high compressive strength
use temperature up to 2400 degree
wear resistance

 Alumina Plate Substrate  

 

 

For this plate/board,mainly the alumina content is 75-99%.It has the features of high reliability,high density power,high thermal conductivity,high insulation and cycling performance.Dimensions can be formed be mould stamping or laser cutting, it is used in thick film circuit,large-scale integrated circuit,hybrid IC,semiconductor package,chip resistor and other electronic industry fields.

 

 

Metallization: Could coat with Copper/Gold/W+Mn Etc.and DBC customized designs!

 

 

Alumina Plate Substrate Technique Datas:

 

 

Alumina Plate Substrate  Photos: