PSC has been in the Thermal Solutions business since 1993.
PSC defines Thermal Solutions as all the components necessary to accomplish the cooling of an Integrated Circuit to a PCB to a
Chassis to an entire Rack.
The Thermal Components can be categorized as Air Moving Devices, Heat Sinks, and Heat Pipes. These three components
sometimes are assembled together as one cooling unit.
The company headquarters have been in Oxnard, California for the past 20 years. PSC in the USA functions as a Sales and
Marketing entity for North America with Warehousing and Engineering design and support capability. PSC China also functions as Sales and Marketing with Engineering team which is responsible for fan/impeller design and also oversees manufacturing.
The PSC China Sales and Management team has four English speaking people so communication is never an issue. PSC World
Wide Sales team (responsible for all areas except North America) operates out of our sales office in Shajing Town, Shenzhen, China
The company core engineering competence in China is focused on the development of a comprehensive line of DC and ECAC
Backward Curved Impeller product line and the continuous engineering of more advanced devices in this product category such as larger ECAC Axial fans.
PSC participates in a Joint Venture factory located in Dong Guan China. This factory is dedicated to manufacturing DC and ECAC Air
Moving devices designed by PSC China engineering team. The PSC China engineering, Manufacturing and Quality Control team
operate out of this China factory.
Over the years PSC has been a major supplier to HP-Compaq, IBM, ATI, Cisco Systems, Rockwell Automation, Bally Gaming
Technologies and is currently working with APC, SGI, Miltope and many companies in Europe and mainland China itself.
The PSC Thermal team is especially capable in the area of Engineering Design and Support. Our engineering has full thermal
simulation and test capability.
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