5850 is suitable for insulation and waterproofing of electronic components with high power and high heat dissipation requirements. This product does not produce any by-products in the curing reaction, and can be applied to metal surfaces and materials such as PC, PP, ABS and PVC. It is fully compliant with the requirements of the EU ROHS Directive
QLD5850 Silicone Gel
Commonly known as jelly glue, suitable for sealing protection of various electronic components, especially precision electronic components.
QLD585T Transparent Potting Compound
Suitable for potting and sealing of electronic components with transparent requirements.
QLD585D Thermally Conductive Flame Retardant Potting Adhesive
Suitable for various potting and sealing of electronic components with thermal conductivity and flame retardant requirements.
QLD585H High Thermal Conductivity Potting Adhesive
Suitable for potting and sealing electronic components with high thermal conductivity requirements.
Performance indicators
Performance indicators | QLD5850 | QLD585T | QLD585D | QLD585H |
Appearances A/B | Colorless and transparent | Colorless and transparent | White/Grey | White/Grey |
Density（g/mm3，A/B） | 0.95~1.05 | 0.95~1.05 | 1.3~1.5 | 1.3~1.5 |
Viscosity（pa.s） | 0.5~1.0 | 0.5~1.5 | 2.5~5.5 | 2.5~6..5 |
Operable time（min） | 60~120 | 60~90 | 60~90 | 60~90 |
Full curing time（h） | 24 | 24 | 24 | 24 |
Initial curing time（60℃，min） | 40 | 40 | 40 | 40 |
Hardness（shore A） | / | 30~65 | 30~65 | 30~65 |
Shearing strength（MPa） | / | 0.8 | 0.8 | 0.8 |
Thermal conductivity（W/M·K） | / | 0.3 | 0.7 | 1.2 |
Flame retardant grade（UL94） | / | HB | V0 | HB |
Dielectric strength（kv/mm） | ≥18 | |||
Volume resistance（Ω·cm，25℃） | ≥1.0×1014 | |||
Applicable temperature（℃） | -60~200 | |||
Operation process
1. Before mixing, first of all, the A component and the B component in their respective containers to mix well.
2. Weigh A and B components according to the ratio, put them into the mixing tank and mix them well. It is best to vacuum defoaming for about 10 minutes, the amount of glue should not exceed 1/2 of the container, otherwise, the glue will overflow when defoaming.
3. Pour the mixed adhesive into the product that needs to be sealed as soon as possible.
4. Filling and sealing workpieces can choose room temperature or heat curing. 60~80℃ can be cured in 30 minutes.
Notes
1. If there is any precipitation or delamination of A and B components, they should be stirred evenly and used without affecting the product performance.
2. This product can not contact with organic tin compounds, sulfur, sulfide, amine compounds and other products, otherwise it may not be cured.
3. Sealed storage in a cool dry place, storage period of six months.
4. Packaging specification: 20KG/set.
