l Two-component encapsulating system based on epoxy
484T transparent potting compound
It is suitable for room temperature potting of digital tubes
484P General Purpose Encapsulant
It is used for potting of general electronic components and circuit board closure protection
484L low viscosity encapsulant
It is suitable for potting circuit boards with high flow requirements
484D thermally conductive flame retardant potting compound
It is suitable for potting protection of modules and circuit boards with high requirements for heat dissipation and flame retardancy
484HTR High Temperature Resistant Encapsulant
It is suitable for bonding, sealing and potting parts under high temperature conditions
Product performance and packaging specifications
Performance | 484T | 484P | 484L | 484D | 484HTR | |||||
Before curing | Color | Clear liquids | Black / Brown | Black / Brown | Black / Brown | Black / Clear liquids | ||||
Viscosity（Pa.S，A/B） | 4/0.7 | 18/0.1 | 12/0.1 | 18/0.1 | 45/0.1 | |||||
Density（g/cm3，A/B） | 1.1/1.0 | 1.6/1.1 | 1.5/1.1 | 1.8/1..1 | 1.8/1.1 | |||||
Mixing ratio，weight-%（A∶B） | 2∶1 | 5∶1 | 5∶1 | 5∶1 | 5∶1 | |||||
Pot life（min） | 30 | 60 | 60 | 60 | 60 | |||||
Complete chemical curing（h） | 48 | 48 | 48 | 48 | 48 | |||||
After curing | Shore-D-hardness（S.D） | ≥80 | ≥80 | ≥80 | ≥80 | ≥80 | ||||
Curing shrinkage（%） | 0.8 | 0.5 | 0.5 | 0.5 | 0.5 | |||||
Thermal conductivity（W/M·K） | 0.3 | 0.3 | 0.3 | 0.7 | 0.7 | |||||
Burning behaviour（UL94） | HB | V0 | HB | V0 | V0 | |||||
Dielectric strength（kv/mm） | ≥25 | |||||||||
Volume resistance（Ω·cm） | 1.2×1014 | |||||||||
Temperature range of use（℃） | -40~90 | -40~90 | -40~90 | -40~90 | -40~150 | |||||
Attributes and Application
484 epoxy potting is a class of two-component, self-leveling, room temperature curing epoxy resin potting material, with excellent aging resistance, moisture resistance, electrical insulation, high hardness and high breakdown voltage. It is suitable for all kinds of pouring bonding and sealing of electronic components.
Processing
1. Clean up the potting place, no oil, no water, no debris.
2. Stir the A component evenly, weigh the A component and the B component according to the ratio, put it into the mixing tank, fully stir and mix evenly, it is best to vacuum and deaeration for about 10 minutes, and the amount of glue should not exceed 1/2 of the container, otherwise the glue will overflow during degassing.
3. Pour the mixed rubber into the product that needs to be potted as soon as possible.
4. The potted workpiece is cured at room temperature, and it takes 1~2 days to completely cure. In summer, the temperature is high, and the curing will be faster; The temperature is low in winter, the curing will be slower, and it can be assembled after 2~3 hours at 60°C.
Notes:
1. If there is precipitation or stratification of component A, it should be stirred evenly and used without affecting the performance of the product.
2. The mixed glue should be used up at one time, and the unused rubber and curing agent should be sealed and stored.
3. Sealed and stored in a cool and dry place for six months.
4. Packing specifications: 30kg/set for 484T, 12kg/set for others.
