Original TBK 125W multifunctional IC grinding platform. XLY-002 Chip Grinding Machine For iPhone screen IC/mobile phone camera lens polishing repair. G+OCA Pro XLY-001 grinder for iPhone 11-15 Pro Max screen IC grinding/rear camera outer ring removing repair.
Features:
1. The new multi-functional IC grinder can polish the mobile phone cable IC, motherboard IC, camera frame and back cover glass. Stepless adjustment speed, Dual height limit micrometer, powerful, one machine, simple operation, Size Mini, a good helper for mobile phone maintenance!
2. One machine for multiple grinding mobile phone cable IC, motherboard IC likehead frame and rear cover glass can be polished.
3. Stepless rotation speed control grinding from left to right,the grinding rotation speed is faster and faster.
