The Turing C256 uncooled infrared module, adopting an advanced 256×192 wafer detector, features compact dimensions, lightweight design, and low power consumption, meeting the SWaP³ design requirements. The split assembly makes it more flexible to use. It comes with multiple auxiliary development tools that support multiple ARM architecture SOC platforms, ensuring ease of use and integration. It also supports the simultaneous output of images and temperature values with a variety of lightweight infrared lenses and extension components. As the best choice for low-cost solutions, this product series can be used in many scenarios such as industry, power, security protection, and machine vision.