Advanced Ceramic Capillary Solution For  Wire Bonding

Ceramic capillary is suitable for semiconductor packing of LED,IC chip and discrete devices

     Ceramic capillary is suitable for semiconductor packing of LED,IC chip and discrete devices,ceramic capillary is a kind of axisymmetric ceramic tool with vertical center hole,high hardness,high dimesional accuracy and long service life.

We offers a wide range of semiconductor bonding tools from Die Attach to Wire Bonding. This includes Die Attach & Vacuum Pick Up Tools, Flip Chip Tools and Semiconductor Wire Bonding Capillaries & Wedges. We offer standard designs as well as custom designs for customer specific packaging requirements and challenges. 

Our Bonding Capillaries differentiate itself from others, utilizing our own exclusive Ceramic Injection Molding (CIM) technology and our own in-house material formulation and sintering processing technologies. We offer a wide range of semiconductor bonding capillaries for standard and ultra fine pitch thermosonic gold,copper and silver alloy wire bonding.

Bonding Capillaries  tip surface finish uses rounded, durable peaks to provide the roughest matte surface finish in the industry.
Lower wire-bonder parameter settings can be applied so that tip wear-out is reduced and same 2nd bond performance can be achieved on tough lead frame material such as Ni/Pd/Au PPF lead frames. Capillary surface roughness and tip shape can be preserved by reducing the stress loadings which normally focus onto small areas of the capillary tip.

Bonding Capillaries is a high-durability ceramic materials and combining high-precision and high-uniformity fabrication techniques, our bonding capillary contributes to improved productivity in the semiconductor assembly process. In addition, our advanced design and analysis capabilities and our expert engineering support contribute to the rapid resolution of customers' technical issues