WL 2-IN-1 CPU NAND Baseband IC BGA Reballing Stencil Platform Positioning Mold for iPhone 6 6S 7 8 X XR XS XS Max
Description :
When you purchase this product for the first time, you must first purchase the magnetic base
Magnetic base + Positioning plate + Tin mesh (Together to use)
Features :
0.1-0.12mm thickness, high hardness, hardly deformed, increase the success rate on BGA reballing solder working
It is the top quality BGA Reballing Stencil for iPhone CPU and NAND, A9 / A8 / A10 / A11 / A12
WL Top quality fast speed BGA Reballing Solder Template Stencil
Optional Positioning Plate (Black) : Not universal, can't working with different BGA Reballing Stencil
Need the right model BGA Reballing Stencil, the Black Positioning Plate just match with the right BGA Reballing Stencil
Package included :
1pc x BGA Reballing Stencil
