JSW615 hot melt adhesive has good impact resistance. It has good bonding properties with various substrates. Product characteristics: Good adhesion: can bond a variety of substrates (such as PP, PC, metal, bonding), pure solid, non-corrosive. Good resistance to high and low temperatures, JSW615 hot melt adhesive can work for a long time in -25℃ ~ 80℃ environment. JSW615 hot melt adhesive bonding technology is gradually establishing and improving its technical standards and process specifications, and expanding its application range. JSW615 hot melt adhesive solution Professional solution to help customers achieve high yield, solid and reliable bonding, to produce higher quality products. JSW615 hot melt adhesive applicable substrate: ABS polycarbonate (PC), PS, UV-coated polyester (including DCPD modification), aluminum alloy (better anodic treatment, nickel-chromium coating (rough surface), the same material or different materials bonded to each other.