Name: Diamond Dicing Blade for motherboard grooving
Brand: Moresuperhard
Availability: InStock

Product Details

Brief Introductions:

Type:	1A1R
Bond:	Resin or Metal
Application:	Glass (optical devices, fiber optics), quartz (optical splitters, saw devices), LiTa03 LiNb03 (devices), QFN （copper epoxy molding ), splitter, sapphire
Specification:	Customized
Brand Mark:	Moresuperhard
Trade Terms:	FOB
Packages:	Hard carton
Delivery Time:	15 workdays by express

Introductions of Moresuperhard’s Dicing Blades

Diamond dicing blade is sintered from a combination of diamond powders and bonds. It comes with excellent form holding characteristics, and an extremely high wear resistance, is used for cutting and slotting of electronic and optical components.

D(mm)	T(mm)	U(mm)	H(mm)	X(mm)
4” /100	0.5, 0.6, 0.8, 1.0, 1.2, 1.5	0.4, 0.5, 0.6, 0.8, 1.0, 1.3.	20, 31.75	5, 10
5”/ 125	0.5, 0.6, 0.8, 1.0, 1.2, 1.5	0.4, 0.5, 0.6, 0.8, 1.0, 1.3	20, 31.75	5, 10
6”/ 150	0.6, 0.8, 1.0, 1.2, 1.5, 1.8	0.5, 0.6, 0.8, 1.0, 1.3, 1.6	20, 31.75	5, 7, 10
8”/ 200	0.8, 1.0, 1.2, 1.5, 1.8	0.6, 0.7, 0.8, 0.9, 1.1, 1.2, 1.4, 1.5.	20, 31.75	5, 7, 10
12”/ 300	1.0, 1.2, 1.4, 1.5, 1.7, 1.8	0.7, 0.9, 1.1, 1.4	20, 31.75	5, 7, 10
16”/ 400	1.2, 1.5, 1.7, 1.8, 1.9, 2.0, 2.3	0.9, 1.2, 1.4, 1.6, 2.0	20, 31.75	5, 7, 10
20”/ 500	1.2, 1.5, 1.7, 1.8, 1.9, 2.0, 2.3	0.9, 1.2, 1.4, 1.6, 2.0	20, 31.75	5, 7, 10
Other size can be made according to customers’ requirement