6 layers impedance PCB with black soldermask
Minimum line width/space: 4mils
Surface finish: immersion gold
Board thickness: 1.60MM
Minimum drilled hole diameter: 8mils
Copper thickness: 1oz
Special process : 0.35MM BGA , black soldermask
Surface Finishing | ENIG |
Min. Line Spacing | 4mils |
Min. Line Width | 4mils |
Min. Hole Size | 0.2mm |
Board Thickness | 1.6mm |
Copper Thickness | 1oz/1oz |
Base Material | FR4 |
6 layers impedance PCB with black soldermask
Minimum line width/space: 4mils
Surface finish: immersion gold
Board thickness: 1.60MM
Minimum drilled hole diameter: 8mils
Copper thickness: 1oz
Special process : 0.35MM BGA , black soldermask