Mijing K35 tin planting platform with BGA reballing stencil for Phone 12 Mini 12 Pro Max logic board soldering repair, MJ K35 metal BGA reballing stencil for Phone 12 12 Mini 12 Pro 12 Pro Max BGA PCB welding repair.

Product Features :

Install the Phone 12/12 Mini/12 Pro/12 Pro Max main board on the platform

Cover the Phone 12/12 Mini/12 Pro/12 Pro Max BGA reballing stencil on mainboard

Evenly spread tin on the cover of the reballing stencil

Remove the reballing stencil cover

Take out the motherboard and cooperate with the hot air gun to solidify the tin point.

Product Specification :

Item Name: MJ K35 Tin Platform

Brand: MiJing

Model: K35

Material: Imported synthetic stone material

Color: Blue + Silver

Size: 120*115*20mm

Weight: 350g

Suit For: Phone 12/12 Mini/12 Pro/12 Pro Max

Application: For Phone 12/12 Mini/12 Pro/12 Pro Max motherboard upper / lower layers logic board soldering repair.