Product Details

Diamond Slurry for Lapping Silicon Carbide

1. Application fields

This product is mainly used for coarse grinding and thinning of silicon carbide wafers.

2. Product Specifications

Product Type	Particle Size	Abrasive Type	Density/Properties
DPI-SiC	D50=2-4μm	Mono diamond	Stable suspension, water-based carrier

Special requirements can be tailor-made.

3. Product characteristics

(1)The product is matched with cast iron plate to achieve high material removal rate meanwhile ensure the quality of silicon carbide wafer (Warp, bow, TTV);

(2)The product has good anti-rust performance;

(3)The product possesses stable suspension of diamond abrasives, and there is no obvious settlement phenomenon when placed for a long time;

(4)Strict quality control to ensure the consistency and stability of product quality.

Diamond slurry for lapping and polishing 1. Application fields

This product is mainly used for lapping and polishing of silicon carbide wafers.

2. Product Specifications

Product Type	Size specification	Abrasive Type	Characteristic
DPP-SiC	D50=2-4μm	Poly/polycrystalline-like diamond	Stable suspension, water-based carrier
	D50=0-1μm	Poly/polycrystalline-like diamond	Stable suspension, water-based carrier
	D50=0.2μm	Polycrystalline-like diamond	Stable suspension, water-based carrier

Special requirements can be tailor-made.

3. Product characteristics

(1)The product is matched with a special silicon carbide Lapping pad to achieve high removal rate and improve efficiency;

(2)High surface quality of the silicon carbide wafer after lapping processing (roughness, scratch, sub-surface damage layer and other parameters);

(3)Water-soluble carrier formula with good cleaning performance;

(4)Stable suspension;

(5)Compared with conventional water-based formula, the product has better lubrication performance.