Sunshine 6 in 1 phone motherboard layered heating platform for Phone X-11 Pro Max CPU, SS-T12A M6 desoldering heating station for Phone X mainboard CPU, Phone logic board frame separate repair tools for Phone X XS XS MAX 11 Pro Max

Product Features :

Silicone non-slip foot pads and cooling holes : Hollow vents and silicone non-slip foot pads are used at the bottom to effectively isolate the temperature, anti-skid and efficient heat dissipation.

High hardness thick synthetic stone : The main body is made of special synthetic stone material, high temperature resistance, strong and durable.

High purity copper film : Ensure uniform and stable heat transfer and heating, and accurate card positioning.

Remove glue from CPU and Other components : Support a variety of chips/universal hard disk/fingerprint cable/CPU degumming and tin removal, accurate card position, non-destructive repair.