electrolytic copper powder of high ratio performance & price
Negotiable
Min.Order:1
Name of product | Particle Size | Loose Density | Purity | Particle shape | Chemical Composition | ||||
Electrolytic Copper powder | -40/-80/-250/ -325/-500/ -800mesh | 1.69 g/cm3 | Cu-99.8%min | dentritic shape | Cu≥ 99.7 , Ni≤ 0.001, Fe≤ 0.01, Pb≤ 0.04, S≤0.004, As≤0.004,Sb≤0.005 ,NO3≤0.05 ,Hydrogen Loss≤0.25 | ||||
Water atomized copper powder | -250mesh,-300mesh,-400mesh | Cu-99.5%min | irregualar shape | Cu:99.8, Ni≤ 0.001, Fe≤ 0.0013, Pb≤ 0.039, S≤0.0028 ,Hydrogen Loss≤0.20 | |||||
Gas atomized copper powder | -250mesh,-300mesh,-400mesh | Cu-99.5%min | spherical shape | Cu:99.8, Ni≤ 0.001, Fe≤ 0.0013, Pb≤ 0.039, S≤0.0028 ,Hydrogen Loss≤0.20 | |||||
Ultra-fine copper powder | -1000mesh | ≤1.2 g/cm³ | Cu-99.7%min | flake shape | Cu- 99.7, O-0.2, S-0.004, Fe-0.02 | ||||
Nano copper powder | 20nm,40nm,50nm,70nm,100nm,300nm | Cu-99.9%min | spherical shape | Cu≥99.9 ,As≤0.002,Bi≤0.001,Fe≤0.005,Ni≤0.004,Pb≤0.001,Sb≤0.002,Sn≤0.001,Zn≤0.04 | |||||
Application | Widely used in diamond tools, electrical carbon products, friction materials, conductive ink and other powder metallurgy products. | ||||||||
Certification | GB/T19001-2008/ISO9001:2008 | Storage | Sealed storage under dry and cool condition | ||||||
Remark: | We can produce the product according to customer'srequirements . |