Property

Units

Value

Condition

Tg, min. ( DSC )

°C

135

CTE x-axis

ppm/°C

14

Ambient to Tg

CTE y-axis

ppm/°C

13

Ambient to Tg

CTE z-axis

ppm/°C

175

Ambient to 288 °C

Solder Float, 288 °C

seconds

>120

Condition A

Property

Units

Value

Condition

Permittivity ( DK ) max.

4.7

C-24/23/50

@ 500 Mhz

4.35

@1 GHz ( HP4291 )

4.34

Loss Tangent ( DF ), max. @

1 MHz ( 2 Fluid Cell )

0.020

500 Mhz

0.017

1 GHz ( 2 Fluid Cell )

0.016

Surface Resistivity, min.

megohms

2 X 10^5

Condition F

1 X 10^8

E-24/125

Volume Resistivity, min.

min.

8 X 10^7

Condition F

megohm- cm

2 X 10^7

E-24/125

Dielectric Breakdown, min

kV

55

D-48/50

Arc Resistance, min.

seconds

100

Property

Units

Value

Condition

Peel Strength, 1 oz.

lb./in.

9.0

Condition A

9.0

After Thermal Stress

9.0

E-1/125

Flexural Strength - LW

psi

80000

Condition A

Flexural Strength - CW

psi

60000

Condition A

Warp & Twist

%

0.5

Condition

Flammability

V-0

UL94

Moisture Absorption

%

< 0.25

D-24/23

Tensil Strength - LW

psi

50000

Condition A

Tensil Strength - CW

psi

40000

Condition A

Tensil Modulus ( Young's ) - LW

psi

3.5 X 10^6

Condition A

Tensil Modulus ( Young's ) - CW

psi

3.0 X 10^6

Condition A

Flexural Modulus ( Taylor's ) - LW

psi

2.7 X 10^6

Condition A

Flexural Modulus ( Taylor's ) - CW

psi

2.4 X 10^6

Condition A

Poisson's Ratio - LW

0.136

Condition A

Poisson's Ratio - CW

0.118

Condition A