The products are mainly high-end double-sided, multi-layer, flexible, high-frequency, HDI arbitrary interconnection, metal base, high thermal conductivity metal base, ceramics, cut-in metal base, cut-in buried capacitance, cut-in thick copper buried magnetic, Concave-convex step substrate, 5G high-speed board, thick copper, thick gold, high carbon resistance, double-sided multi-layer MiNiLED, MiNiHDILED, MiNiOLED, IC carrier substrate, roll-to-roll FPC, ultra-long FPC, ultra-large printed circuit board, special materials Integrated OEM and ODM production plants such as printed circuit boards.