yushunli YS-A20 hot air bga welding equipment
Festures of yushunli YS-A20 hot-air BGA rework system:
1.heating feature:both top and bottom heating power up to 1200W,brushless motor,the max airflow up to 60L/s,large infrared preheating area (4000W) at the bottom side,even heat distribution.
2.high automation,one-touch for rework,soldering,pick-up and placement of chip,easy operation.
3.large power brushless DC fan,closed loop sensor,microcomputer zero trigger control,large volume air with constant temperature.no need of external air source,flexible application.
4.seven-phase temperature zone,can be used for light-reflecting BGA,multi-layer BGA and metallic shielding case,POP.
5.integrated design,the heating and alignment systems integrate well.
6.dichromatic optical prism alignment,joystick control.
7.transverse flow fan,air speed controllable,cool down bottom heating area and PCB as per process requirement.
8.SOFT interface,operation access and profile analysis functions available,can analyze preheating speed,peak
temperature,temperature holding time and cooling rate effectively.
9.various nozzles,easy replacement.
10.applications:PC,server Motherboard,IPC,Terminal and large PCB rework BGA of CONNECT.
Specifications:
Genaral power | 6600W(max) |
Voltage | 220V AC 50HZ |
Hot air heating temperature | 400℃(max) |
Bottom preheating temperature | 400℃(max) |
Power of top heater(hot air) | 1200W |
Power of bottom heater(hot air) | 1200W |
Power of bottom heater(infrared preheating) | 4000W |
Hot air flow | 60L/s |
Max PCB size | 600*650mm |
BGA size range | 2*2-60*60mm |
Placement precision | ±0.2mm |
Air speed of side cooling fan | ≤3.5m³/min |
Camera | 36*12 times magnifying |
horizontal resolution 500 lines | |
PAL format | |
External K-type sensor | 5 ports |
Communication | USB |
Weight | 160kg |
Dimensions | 1200(L)*800(W)*940(H)mm |