Product Details

450*430 Mm 15W UV PCB Separator / FR4 Board Laser Depaneling Equipment ±20 μM Precision

Description

PCB Separator / FR4 Board Laser PCB Depaneling Machine ±20 μM Precision

The laser process is completely software-controlled. Varying materials or cutting contours are easily taken into account through adapting the processing parameters and laser paths.
In the case of laser cutting with the UV laser, no appreciable mechanical or thermal stresses occur.
The laser beam merely requires a few µm as a cutting channel. More components can thus be placed on a panel.
The system software differentiates between operation in production and setting up processes. That clearly reduces instances of faulty operation.
The fiducial recognition by the integrated vision system is done in the latest version around 100% faster than before.

Laser Depanelizer Machine,YSATM-3L Feature:

1. High precision CCD automatic positioning, automatic focusing. Fast and accurate positioning, save time and no worries.

2. Friendly interface,Simple operation, easy to use, free application; Small size, Save more space; rigorous security design;

3. Reduce energy consumption, Cost savings.

4. Cost-effective, fast cutting speed, stable performance

Laser Depanelizer Machine, YSATM-3L Specification: