Eelectroformed hub dicing blade is used for cutting Silicon Wafers, copper wafer, IC/LED Packages, Compound Semiconductor Wafers (GaAs, Gap), Oxide Wafers (LiTaO3), Optical Glass.
Details
Electroformed hub dicing blade is made by using an ultra-thin diamond wheel and a high precision aluminum alloy hub.
Applications Of Hub Dicing Blade
Cutting Silicon Wafers, copper wafer, IC/LED Packages, Compound Semiconductor Wafers (GaAs, Gap), Oxide Wafers (LiTaO3), Optical Glass
The Features Of Hub Type Dicing Blade
* Improving balance between blade life and processing quality (in particular backside chipping)
* Strengthens rigidity, Reduction in wavy cutting and blade wear under high load conditions
* Precise control of diamond grit size, diamond concentration, and nickel bond hardness to reduce splitting on the edges
* Realizes high speed wafer cutting after laser grooving
The Specifications Of Hub Type Dicing Blade
Exposure(μm) | 380 | 510 | 640 | 760 | 890 | 1020 | 1150 | 1270 | Grit Size |
Kerf width(μm) | 380-510 | 510-640 | 640-760 | 760-890 | 890-1020 | 1020-1150 | 1150-1270 | 1270-1400 | #5000 #4800 #4500 #4000 #3500 #3000 #2500 #2000 #1800 #1700 #1500 |
16-20 | 20*380 | 20*510 | |||||||
21-25 | 25*380 | 25*510 | 25*640 | ||||||
26-30 | 30*380 | 30*510 | 30*640 | 30*760 | 30*890 | 20*1020 | |||
31-35 | 35*380 | 35*510 | 35*640 | 35*760 | 35*890 | 35*1020 | |||
36-40 | 40*380 | 40*510 | 40*640 | 40*760 | 40*890 | 40*1020 | 40*1150 | ||
41-50 | 50*380 | 50*510 | 50*640 | 50*760 | 50*890 | 50*1020 | 50*1150 | ||
51-60 | 60*510 | 60*640 | 60*760 | 60*890 | 60*1020 | 60*1150 | 60*1270 | ||
61-70 | 70*640 | 70*760 | 70*890 | 70*1020 | 70*1150 | 70*1270 | |||
71-80 | 80*890 | 80*1020 | 80*1150 | 80*1270 | |||||
81-90 | 90*1020 | 90*1150 | 90*1270 |
