ALN/Aluminum Nitride Substrate/Plate/Disc/INNOVACERA
With its properties of electrical insulation and excellent thermal conductivity, Aluminum Nitride Ceramics is ideal for applications where heat dissipation is required. In addition, since it offers a coefficient of thermal expansion (CTE) near that of silicon, and excellent plasma resistance, it is used for semiconductor processing equipment components.
Advantages:
· High thermal conductivity combined with good electrical insulation characteristics.
· Exceptional stability when exposed to many molten salts.
· Thermal stability up to at least 1500°C
· Favorable mechanical characteristics extending into the high temperature range.
· Low thermal expansion and resistance to thermal shock.
· Special optical and acoustic characteristics.
