It is a non-contact type injection dispensing valve. It is widely used in surface mount, conductive silver paste, IC sealing, underfill, sealant, surface coating, etc. Can enter a narrow space of as small as 100 microns, and can finish the precise glue dispensing at the specified position of 0.01 milligram level. And is mainly applied to the bottom filling of the patch in the field of SMT. This is the only product in the field of domestic fluid control which has the technology and is widely used and mature to realize the mass production. It is also the core component of the underfill integrated dispensing equipment system in the bottom of the SMT area, which breaks through the overseas technical monopoly and has a significant advantage in the cost.

Characteristics and advantages: high speed, no Z axis movement necessary for traditional contact dispensing process, and the dispensing speed is more than 3 times 7 times of that of contact dispensing process. The minimum rubber content of high precision is 5nl, and the minimum diameter of glue spot can be controlled to 0.3mm, and it has the consistency that the traditional needle dispensing can not be achieved.

High flexibility:  highly insensitive to dispensing, which can avoid the bad effect caused by needle collision with workpiece; the minimum amount of glue makes it possible to work in more compact space and complete the dispensing process which can not be realized by needle dispensing. Low maintenance and high life advanced structural design, daily cleaning and maintenance is simple and easy. The most advanced polymer wear-resistant material accessories, is more than 20 times the life of ordinary materials.