Large size motherboard BGA soldering rework station ZM-R730A BGA repair machine
USD $9800 - $10800 /Piece
Min.Order:1 Piece
SEAMARK ZM TECHNOLOGY GROUP COMPANY LTD
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Features
● Ceramic honeycomb heating system for Top heater, thermal convert efficiently.
● Carbon fiber heaters for Pre-heating system, wide range for moving around make the PCB Pre-heating
more evenly.
● Various operating modes,easily operate, do the chip desoldering and soldering by one key.
● 10 temperature zone control, in line with the lead-free rework process.
● Temperature curve analysis function built-in.
● In order to eliminate the "observation dead angle"problem and ensure the precision for placement, we selected HD optical alignment system which allows all angle observation for BGA edge fast and convenient.
● X, Y axis with micrometer adjustment, adjustment accuracy up to ± 0.01mm.
● High-precision K-type sensors allows precision detection for different spots in PCB and BGA and analysis temperature curve automatically.
● Standard automatic feeder, feeding and collecting asthmatically.
● Mounting head 360 ° electric rotation.
● Japan THK linear rail for linear motion system which guarantee the running accuracy.
● 10 inch industrial touch screen for HMI
● Panasonic high-performance PLC for motion control, to ensure high stability.
● Japan's Panasonic photoelectric sensor to ensure high reliability.
Main Parameters
Power Supply AC 380V /AC220 50/60 Hz
Total Power Max 7500W
Top Heater Power 1200 W
Bottom Heater Power 1200 W
Preheat heater Power 4800 W
IR heater Size 420mm*435mm
Mount precision: ±0.01mm
PCB Thickness 0.5~8mm
Mount Pressure <0.2N
Hot Air Heating Temperature 400℃(Max)
PCB Max Size 645mm×520mm
Chip Size Range 3×3mm--80×80mm
Worktable Fine Tuner X & Y 1CM
Measurement L1000×W840×H950mm
Sensor 5pcs
Machine Weight 128kg
Color White&Grey